
User's GuideSLUU824–December 2011bq3055EVM SBS 1.1 Compliant Advanced Gas GaugeBattery Management Solution EVMThe bq3055EVM is a complete evaluat
COMPUTEREV2300 orEV2400SMBus cableUSBLOAD/CHARGER+-Hardware Connectionwww.ti.comFigure 9. bq3055 Circuit Module Connection to Cells and System Load/Ch
www.ti.comOperation8 OperationThis section details the operation of the bq3055 EVSW software.NOTE: The EV2300 or EV2400 driver does not support Window
Operationwww.ti.comFigure 10. SBS Data ScreenThis screen shows the SBS data set along with additional ManufacturersAccess() command information,such a
www.ti.comOperationFigure 11. Data Flash Screen, 1st Level Safety ClassTo read all the data from the bq3055 data flash, click on menu option | Data Fl
Calibration Screenwww.ti.com9 Calibration Screen9.1 How to CalibrateThe bq3055 must be calibrated using power supplies or a power supply and cell simu
www.ti.comCalibration ScreenFigure 12. Calibration Screen15SLUU824– December 2011 bq3055EVM SBS 1.1 Compliant Advanced Gas Gauge Battery ManagementSol
Pro (Advanced) Screenwww.ti.com10 Pro (Advanced) Screen10.1 SMB CommunicationThe set of read/write operations over SMBus are not specific to any gas g
www.ti.comRelated Documentation from Texas InstrumentsFigure 13. Pro (Advanced) Screen11 Related Documentation from Texas InstrumentsFor related docum
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMSTexas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following c
FCC Interference Statement for Class B EVM devicesThis equipment has been tested and found to comply with the limits for a Class B digital device, pur
Featureswww.ti.com3 Performance Specification Summary... 94 Circuit
【【Important Notice for Users of this Product in Japan】】This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Ja
EVALUATION BOARD/KIT/MODULE (EVM)WARNINGS, RESTRICTIONS AND DISCLAIMERSFor Feasibility Evaluation Only, in Laboratory/Development Environments. Unless
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherch
www.ti.combq3055 Circuit Module Schematic2.2 Pin DescriptionsPIN NAME DESCRIPTION1N –ve connection of first (bottom) cell1P +ve connection of first (b
Circuit Module Physical Layouts and Bill of Materialswww.ti.comFigure 2. Top AssemblyFigure 3. Top LayerFigure 4. Inner Layer 14bq3055EVM SBS 1.1 Comp
www.ti.comCircuit Module Physical Layouts and Bill of MaterialsFigure 5. Inner Layer 2Figure 6. Bottom LayerFigure 7. Bottom Assembly5SLUU824– Decembe
Circuit Module Physical Layouts and Bill of Materialswww.ti.com4.2 Bill of MaterialsTable 2. Bill of MaterialsReferenceCount Value Description Size Pa
www.ti.comCircuit Module Physical Layouts and Bill of MaterialsTable 2. Bill of Materials (continued)ReferenceCount Value Description Size Part Number
2VSS111P4PPACK -SYS PRESSMBD3P2P2SMBCPACK+1NWakeNot installed.For Thumbus-SMBIC ground should be connected to the 1N cell tab.C10.1uFC30.1uFR81KR61KR5
www.ti.comEVM Hardware and Software Setup4.3 bq3055/bq29440 Circuit Module Performance Specification SummaryThis section summarizes the performance sp
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