Mitsubishi Electric G310 Specifiche Scaricare il pdf

TECHNICAL BULLETI

[Issue No.] FA-A-0171 [Page] 1/62

[Title] Differences between MELSEC-Q series and MELSEC iQ-R series

[Date of Issue] November 2014

[Relevant Models] MELSEC iQ-R series

HEAD OFFICE : TOKYO BUILDING, 2-7-3 MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN

NAGOYA WORKS : 1-14, YADA-MINAMI 5-CHOME, HIGASHI-KU, NAGOYA, JAPAN

Thank you for your continued support of Mitsubishi programmable controllers, MELSEC-Q series.

This bulletin provides differences between MELSEC-Q series and MELSEC iQ-R series.

Note that the reference manuals or the references described in this bulletin are information as of September 2014.

Contents

GENERIC TERMS ·························································································································· 2

1 DIFFERENCES BETWEEN MELSEC-Q SERIES AND MELSEC iQ-R SERIES ············································ 3

1.1 Configurable Devices ················································································································ 3

1.2 CPU Modules (QnUDVCPU and RCPU)························································································· 4

1.2.1 Instructions ······················································································································· 4

1.2.2 Parameters ························································································································ 8

1.2.3 Devices and files················································································································ 12

1.2.4 Functions ························································································································ 17

1.3 Power Supply Modules, Base Units, I/O Modules ·············································································· 26

1.3.1 Power supply modules ········································································································· 26

1.3.2 Base units ························································································································ 26

1.3.3 I/O modules ····················································································································· 26

1.4. Intelligent Function Modules ······································································································ 27

1.4.1 Analog-digital converter modules ···························································································· 27

1.4.2 Digital-analog converter modules ···························································································· 28

1.4.3 Simple motion modules ······································································································· 29

1.4.4 Positioning modules············································································································ 30

1.4.5 High-speed counter modules ·································································································· 31

1.5. Communication Modules and Network Modules ·············································································· 32

1.5.1 Common items for communication modules and network modules ···················································· 32

1.5.2 Ethernet interface modules ···································································································· 34

1.5.3 CC-Link IE Field Network master/local modules ········································································· 41

1.5.4 CC-Link system master/local modules ······················································································ 43

1.5.5 Serial communication modules ······························································································· 44

2 SPECIFICATIONS DIFFERENCES BETWEEN MELSEC-Q SERIES AND MELSEC iQ-R SERIES ·················· 46

2.1 CPU Modules (QnUDVCPU and RCPU)························································································ 46

2.2 Power Supply Modules, Base Units, I/O Modules ·············································································· 50

2.3. Intelligent Function Modules ······································································································ 51

2.3.1 Analog-digital converter modules ···························································································· 51

2.3.2 Digital-analog converter modules ···························································································· 52

2.3.3 Positioning modules············································································································ 53

2.3.4 High-speed counter modules ·································································································· 54

2.4. Communication Modules and Network Modules ·············································································· 56

2.4.1 Ethernet interface modules ···································································································· 56

2.4.2 CC-Link IE Field Network master/local modules ········································································· 59

2.4.3 CC-Link system master/local modules ······················································································ 62

2.4.4 Serial communication modules ······························································································· 62

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